3d ic integration and packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption based on a course developed by its author this practical guide offers real world problem solving methods and teaches the trade offs inherent in making system level decisions. Types 3d ics vs 3d packaging 3d packaging refers to 3d integration schemes that rely on traditional methods of interconnect such as wire bonding and flip chip to achieve vertical stacks 3d packaging can be disseminated further into 3d system in package 3d sip and 3d wafer level package 3d wlp stacked memory die interconnected with wire bonds and package on package pop configurations . a comprehensive guide to 3d ic integration and packaging technology 3d ic integration and packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption based on a course developed by its au. 3d ic integration is taking the semiconductor industry by storm it has been a impacting chip suppliers fab less design houses foundries integrated device manufacturers outsourced semiconductor assembly and test substrates electronic manufacturing service original design manufacturers original equipment manufacturers material and equipment suppliers universities and research . In general 3d integration is a broad term that includes such technologies as 3d wafer level packaging 25d and 3d interposer based integration 3d stacked ics monolithic 3d ics 3d heterogeneous integration and 3d systems integration this video 3d chip technology for dummies from applied materials breaks it down in very easy to